Processing Project of Annually Producing 100,000 8’’ Silicon Chips and 0.25μm Integrate Circuit Die

TIME:2006-11-23       SOURCE:

Project No. 2006-sy-01-876
Project Domain Industry
Region shenyang
Construction Site Hunnan Development Zone
Construction Content Total Investment: RMB 10 billion yuan
Construction Period: 2 years
Construction Content: total land use area for the project is 400,000sq.m. and total building area is 300,000sq.m. including production workshop, storage and water supply treatment station, office building, transformer station, air supply and auxiliary supporting facilities. The project production line will adopt CMOS process.

Contact: Yue Guijiun
Contact Tel: 024-22723117
Fax: 024-22734066

Market Forecast Over recent years, with the development of social economy and improvement of people’s living standard in our country, electronic information products have been applied more and more widely. The continuous emergence of electronic processed products in varieties helps the drastic upsoaring of demand for integrate circuit (IC) products. As accounted and predicted on China’s IC market consumption by CCID, the IC consumption in our state was about 20 billion pieces in 2000 and increased to 36 billion pieces in 2005, at an annual compound growth rate of over 12%. According to the forecast of In State, a world known information agency, the total demand value in domestic semi-conductor market will go up to USD 41.5 billion in 2010; while as per the forecast of CahnersIn-Stat, China will become the second internationally largest semi-conductor market in 2010. China’s IC international market share drastically went up to 13% in 2005 from 4.8% in 1999. Based on this, we can work out that because of the increasing demand for IC products in our state, the supply will be in severe shortage, and there is great profit space.
Economic Benefit Analysis:
Output Value: RMB 6.6 billion yuan
Profit: RMB 1.3 billion yuan
Tax: RMB 0.55 billion yuan
Investment Recovery Period: 6 years
Cooperative Patterns Joint-venture Cooperation
Project Feedback
Project No.
2006-sy-01-876
Project Name
Processing Project of Annually Producing 100,000 8’’ Silicon Chips and 0.25μm Integrate Circuit Die
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Sponsor: Shenyang Development & Reformation Commission
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